发明名称 |
Flip-chip bonding structure and method for making the same |
摘要 |
Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.
|
申请公布号 |
US6799713(B2) |
申请公布日期 |
2004.10.05 |
申请号 |
US20030654111 |
申请日期 |
2003.09.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JOO-HOON;CHOI DUK-YONG;KIM DONG-SU |
分类号 |
G02B6/122;G02B6/42;H01L21/60;H01S5/02;(IPC1-7):B23K31/02;B21D39/00 |
主分类号 |
G02B6/122 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|