| 摘要 |
A design support apparatus, when designing multichip packages, verifies connections between a semiconductor chip and leads of a lead frame. Distances between two wires or distances between the wires and the other components are calculated using three-dimensional drawing data (CAD data) and semiconductor package data. Components of the semiconductor packages such as wires, lead frames, or die pads are drawn in the three-dimensional drawing data. The semiconductor package data describes specifications of the semiconductor packages such as outer sizes of the packages. Distance values are compared with design rule data. The design rule data defines constraints on the positional relationship between each wire and each component. The design support apparatus determines whether the acquired positional relationship is proper on the basis of design rule data.
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