发明名称 Method of making a composite substrate
摘要 The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same.
申请公布号 US6800322(B2) 申请公布日期 2004.10.05
申请号 US20010971699 申请日期 2001.10.09
申请人 TDK CORPORATION 发明人 TAKEISHI TAKU;NAGANO KATSUTO;HAGIWARA JUN;TAKAYAMA SUGURU
分类号 H05B33/02;H05B33/10;H05B33/12;H05B33/22;(IPC1-7):B05D5/12 主分类号 H05B33/02
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