| 发明名称 |
Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
| 摘要 |
An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.
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| 申请公布号 |
US6800218(B2) |
申请公布日期 |
2004.10.05 |
| 申请号 |
US20010935805 |
申请日期 |
2001.08.23 |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
MA YING;JONES MICHAEL;BAUM THOMAS H.;VERMA DEEPAK;BERNHARD DAVID |
| 分类号 |
C09G1/04;C23F3/06;H01L21/321;(IPC1-7):C09K13/00 |
主分类号 |
C09G1/04 |
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