发明名称 HEATED SUBSTRATE SUPPORT
摘要 <p>A heated substrate support and method for making the same is generally provided. In one embodiment, a heated support includes a first and second plates having a heating element disposed therebetween. The heating element is biased against the first plate to provide good heat transfer therewith. In another embodiment, a heated support includes a first metallic plate coupled to a second metallic plate and sandwiching at least one guide therebetween. A resistive heating element is laterally retained by the guide relative to the first plate. In another aspect of the invention, a heating chamber for heating a substrate is provided. In one embodiment, the heating chamber includes walls defining an interior volume and a plurality of heated support plates coupled to the walls. The support plates are generally stacked parallel to each other within the interior volume. A heating element is urged against each first support plate.</p>
申请公布号 KR20040083453(A) 申请公布日期 2004.10.01
申请号 KR20047012403 申请日期 2003.01.30
申请人 发明人
分类号 H01L21/02;H01L21/324;H01L21/00;H01L29/786 主分类号 H01L21/02
代理机构 代理人
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