发明名称 WAFER LOADING SYSTEM OF HEAT TREATMENT EQUIPMENT FOR FABRICATING SEMICONDUCTOR DEVICE TO IMPROVE PRODUCTIVITY
摘要 PURPOSE: A wafer loading system of heat treatment equipment for fabricating a semiconductor device is provided to perform stably a fabrication process and improve the productivity by using an identification mark and a detection sensor for sensing the identification mark. CONSTITUTION: A boat(32) includes identification marks for each loading part of plural wafers, a side dummy, and a monitoring wafer. A robot is used for loading the plural wafers, the side dummy, and the monitoring wafer. A detection sensor is installed at the robot in order to recognize the identification mark. A database is used for storing information about plural wafers. A controller is used for receiving the wafer information and sensing signals of the detection sensor to perform a predetermined process from the database and controlling an operation of the robot.
申请公布号 KR20040083124(A) 申请公布日期 2004.10.01
申请号 KR20030017661 申请日期 2003.03.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, GYEONG OK
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
代理机构 代理人
主权项
地址