| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding method restraining the influence of injection pressure and heat to the minimum when forming an insulation cover layer on an electronic component by injection or compression method, and heightening the tensile strength of a lead wire in case that the electronic component is a coin-type battery with a lead wire, and to provide the electronic component. SOLUTION: On the method of covering the electronic component with the insulation cover under low pressure and low temperature, the battery 10 is fixed in a cavity 4 of a mold 1, and a space 18 is formed between the battery 10 and the inner wall surface of the cavity 4, and a hot-melt adhesive capable of being molded by injection molding under low pressure and low temperature is injected in the space 18, and the cavity 4 is opened after the injected hot-melt adhesive is cooled and solidified. By the above, the surface of the battery 10 is covered by the hot-melt adhesive, and a tightly adhered insulation cover layer 19 can be formed. Since the hot-melt adhesive is tightly adhered on the cover of the lead wire 13, the tensile strength of the lead wire 13 is improved. COPYRIGHT: (C)2004,JPO&NCIPI
|
