发明名称 SUBSTRATE FOR THERMOELECTRIC MODULE, MANUFACTURING METHOD THEREFOR, AND THE THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a thermoelectric module that can prevent detachment from taking place in the interface between a metal substrate and an insulating film, even if a heat cycle or a thermal shock is added, by forming unevennesses on the metal substrate, forming a stress relaxation film between the metal substrate and the insulating film, and further, forming the insulating film and the stress relaxation film in divided sections, as well as the manufacturing method for the substrate and a thermoelectric module. SOLUTION: An insulating film 4 is formed on a substrate 2, where unevenness is formed on its surface 3, and an electrode 6 is formed on the insulating film 4. At this time, the insulating film 4 is impregnated with an organic or inorganic material, such as epoxy resin, silicone, SiO<SB>2</SB>. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004274072(A) 申请公布日期 2004.09.30
申请号 JP20040130347 申请日期 2004.04.26
申请人 YAMAHA CORP 发明人 ONOE KATSUHIKO;TAKEUCHI NANAYUKI;HOSHI TOSHIHARU;IIJIMA KENZABURO
分类号 H01L35/34;H02N11/00;(IPC1-7):H01L35/34 主分类号 H01L35/34
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