发明名称 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
摘要 |
A depression is formed in a semiconductor substrate, in which an integrated circuit is formed, from a first surface of the semiconductor substrate. A conductive section is formed in the depression. The conductive section is caused to project from a second surface of the semiconductor substrate opposite to the first surface. The conductive section is ground or polished until the fresh surface is exposed.
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申请公布号 |
US2004192033(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20040757372 |
申请日期 |
2004.01.14 |
申请人 |
HARA KAZUMI |
发明人 |
HARA KAZUMI |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L21/768;H01L23/12;H01L23/31;H01L23/48;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L21/301 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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