发明名称 Mobile, electrostatic substrate click for wafers in semiconductor manufacture, comprises additional capacitor structures for charge storage, extending over several electrode levels, on support substrate
摘要 <p>In mobile electrostatic substrate chuck (1), additional capacitor structures for charge storage extend over several electrode levels on support substrate. Capacitor structures form energy stores for providing clamping force of mobile electrostatic substrate chucks. There are several layers of identical or diverse dielectric thin films stacked between electrodes (3,4;5,6) on insulating support substrate, with individual films 0.01 to 40 microns thick. Extra dielectric film (7) separate electrodes (3,4).</p>
申请公布号 DE202004010351(U1) 申请公布日期 2004.09.30
申请号 DE20042010351U 申请日期 2004.07.02
申请人 VENTEC GESELLSCHAFT FUER VENTUREKAPITAL UND UNTERNEHMENSBERATUNG MBH 发明人
分类号 B81B1/00;H01L21/683;(IPC1-7):H01L21/68;B81C5/00 主分类号 B81B1/00
代理机构 代理人
主权项
地址