Thin-film solder for connecting micro-electromechanical components, comprises mixture of gold and bismuth, e.g. in eutectic mixture

摘要

The solder comprises a mixture of gold and bismuth (1). The solder preferably comprises at least a proportion of an eutectic mixture of gold and bismuth. Independent claims are included for a micro-electromechanical component with a solder layer for connecting to further component(s); and for a method of manufacturing a micro-electromechanical component.