发明名称 LAMINATED ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laminated electronic component having a structure which reduces influence given to the identification capability of a mark by variation in formation range of an edge electrode and that at a cutting position, increases efficiency in directivity selection, and improves yields, and also to provide a method for manufacturing the laminated electronic component. SOLUTION: The mark 4 indicating the winding direction of a coil 2 is provided at a position leaned to one of ends in a shorter direction over length exceeding the half in the longitudinal direction of a laminate 1 or an entire length on the upper surface or both the upper and the lower surfaces of the laminate 1. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273625(A) 申请公布日期 2004.09.30
申请号 JP20030060095 申请日期 2003.03.06
申请人 TDK CORP 发明人 ISHIFUNE MITSURU;SATO SHINICHI;KUMAGAI OSAMI
分类号 H01F41/04;H01F17/00;H01F27/00;(IPC1-7):H01F27/00 主分类号 H01F41/04
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