发明名称 HEAT SHRINK PACKAGING METHOD AND HEAT SHRINK PACKAGE
摘要 PROBLEM TO BE SOLVED: To enhance dust adhesion properties by the use of a heat shrink film which excels in electrostatic sealing properties, minimizes sticking of trashes and dusts thereon and provides an excellent packaging finish. SOLUTION: In the heat shrink packaging method by an electrostatic sealing method for performing automatic packaging of articles to be packaged using a heat shrink film by the electrostatic sealing method, the heat shrink film to which an antistatic agent is added and having a surface resistance rate of not greater than 10<SP>14</SP>Ωis used, and, in addition, at least a part of the heat shrink film or preferably an electrostatic sealing part is heated up to 50°C or more once and then applied with the static seal. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004268993(A) 申请公布日期 2004.09.30
申请号 JP20030063688 申请日期 2003.03.10
申请人 KOHJIN CO LTD;TOKIWA KOGYO KK 发明人 MORITA SHUICHI;MORIYAMA TAMIO;KOSHIRO HISASHI;KAMEDA MINORU
分类号 B65B53/02;B65B53/00;(IPC1-7):B65B53/02 主分类号 B65B53/02
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