发明名称 SPUTTERING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To form a homogeneous, high-precision optical thin film with a desired film-thickness distribution on substrates having various shapes through a method different from conventional ones. <P>SOLUTION: In a sputtering apparatus, the film is formed through physical vapor deposition on the substrate having an irregular or flat shape. The apparatus has at least three control axes which can independently modify the relative positions, etc. of the substrate and cathodes during film formation. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004269988(A) 申请公布日期 2004.09.30
申请号 JP20030064209 申请日期 2003.03.10
申请人 CANON INC 发明人 ANDO KENJI;KANAZAWA HIDEHIRO
分类号 G02B5/10;C23C14/22;C23C14/34;C23C14/50;G02B1/11 主分类号 G02B5/10
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