| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure and a manufacturing method of a semiconductor device, with which a disconnection failure of conductor wiring formed in a resin substrate is difficult to occur at the time of phase down-mounting the semiconductor device on the resin substrate. <P>SOLUTION: An insulating spacer layer lower than a bump electrode is arranged in a gap between the semiconductor device and a resin substrate. Even if a phenomenon where the resin substrate dents when the resin substrate and the semiconductor device are thermo-compressively bonded through insulating resin is caused, a spacer layer acts as a buffer material, and conductor wiring is not disconnected since the spacer layer is installed in a part where the semiconductor device abuts on the resin substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
