发明名称 MOLDING HOUSING DEVICE AND RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a molding housing device capable of efficiently switching a housing system in response to a type of a workpiece without increasing a footprint of the device. SOLUTION: Housing units 27, 28 provided with housing magazines 15, 18 having a different pattern for housing moldings is positioned and mounted on a unit-mounting part 26 of a base unit 19 to which an elevating rod 25 elevated by driven by a motor 21 is supported in projecting to the housing magazine side through the unit-mounting part 26. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273773(A) 申请公布日期 2004.09.30
申请号 JP20030062632 申请日期 2003.03.10
申请人 APIC YAMADA CORP 发明人 NAKAMURA KAZUO;NAKASONE AYAKO
分类号 H01L21/50;H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/50
代理机构 代理人
主权项
地址