发明名称 SEALANT CURING METHOD AND SEALANT CURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sealant curing method using UV capable of obtaining satisfactory curing characteristics of the sealant applied on a substrate nearly free from an energy loss and thermal influence on the substrate and having excellent sticking characteristics when two substrates are stuck to each other via the sealant. SOLUTION: A sealant curing device is a device for curing the sealant by applying the UV reactive sealant on the substrates and irradiating the sealant with UV. The sealant curing device is provided with an irradiation device 20 irradiating the sealant with light comprising UV in a pulse shape and a controlling part 30 controlling the irradiation so that the sealant is irradiated with the light at least once in the pulse shape by using the irradiation device 20. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004271661(A) 申请公布日期 2004.09.30
申请号 JP20030059439 申请日期 2003.03.06
申请人 IWASAKI ELECTRIC CO LTD 发明人 SAKAI KAZUHIRO
分类号 G02F1/13;C03C27/10;G02F1/1339;(IPC1-7):G02F1/13;G02F1/133 主分类号 G02F1/13
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