发明名称 Surface-acoustic-wave component adapted to electronic circuit and device, and manufacturing method therefor
摘要 A surface-acoustic-wave component that comprises a first piezoelectric layer composed of zinc oxide (ZnO), a second piezoelectric layer composed of lithium niobate (LiNbO3), and a protective layer, which are sequentially formed on a silicon substrate, on which electrodes (e.g., interdigital transducers) are further formed. Alternatively, it comprises a conductive layer composed of zinc oxide (ZnO), a piezoelectric layer composed of lithium niobate (LiNbO3), and a protective layer, which are sequentially formed on a silicon substrate, on which electrodes are further formed. The piezoelectric layer can actualize preferable orientation so as to improve the electromechanical coupling coefficient (K<2>). Thus, it is possible to produce surface-acoustic-wave components that contribute to manufacturing of highly-integrated electronic circuits such as frequency filters and oscillators as well as electronic devices such as portable telephones.
申请公布号 US2004189425(A1) 申请公布日期 2004.09.30
申请号 US20040753237 申请日期 2004.01.07
申请人 IWASHITA SETSUYA;HIGUCHI TAKAMITSU;MIYAZAWA HIROMU 发明人 IWASHITA SETSUYA;HIGUCHI TAKAMITSU;MIYAZAWA HIROMU
分类号 H01L41/09;H01L41/22;H03B5/30;H03H9/02;H03H9/05;H03H9/25;H03H9/64;(IPC1-7):H03H9/64 主分类号 H01L41/09
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