| 摘要 |
A semiconductor device includes a module board having a top surface and a backside surface, a lower chip having a first circuit operated at a first frequency and a second circuit operated at a second frequency, an upper chip disposed so as to overlie lower chip and having a first circuit and a second circuit, a plurality of wires electrically bonding the upper chip to the module board, and electrically bonding the lower chip to the module board, respectively, and a plurality of chip components on the module board. The first circuit of the upper chip is disposed opposite to the second circuits of the lower chip, while the second circuit of the upper chip is disposed opposite to the first circuits of the lower chip. As a result, interference by high frequencies will hardly occur between the wires bonded to the upper and lower chips.
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