发明名称 |
Multiple stepped aperture repair of transparent photomask substrates |
摘要 |
A method for repairing a transparent photomask substrate and a transparent photomask substrate repaired in accord with the method employ when eliminating a defect within a transparent photomask substrate a multi-stepped aperture having a series of progressive steps which separate a series of progressive plateaus. Each plateau has a plateau width and a step height such as to enhance transparent photomask substrate transmittance within the multi-stepped aperture. The method provides for efficient repair of a transparent photomask substrate.
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申请公布号 |
US2004191642(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030402196 |
申请日期 |
2003.03.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN CHENG-MING |
分类号 |
G03C5/00;G03F1/00;G03F9/00;(IPC1-7):G03F9/00 |
主分类号 |
G03C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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