发明名称 |
METHOD AND APPARATUS FOR THERMALLY INSULATING ADJACENT TEMPERATURE CONTROLLED PROCESSING CHAMBERS |
摘要 |
A dual chamber apparatus including a first chamber and a second chamber which is configured to be coupled to the first chamber at an interface. Each of the first chamber and the second chamber has a transfer opening located at the interface. An insulating plate is located on one of the first chamber and the second chamber at the interface and is configured to have a low thermal conductivity such that the first chamber and the second chamber can be independently controlled at different temperatures when the first chamber and the second chamber are coupled together. Additionally, the apparatus may include an alignment device and/or a fastening device for fastening the first chamber to the second chamber. In embodiments, the insulating plate may be constructed of Teflon. Further, the first chamber may be a chemical oxide removal treatment chamber and the second chamber may be a heat treatment chamber. |
申请公布号 |
WO2004084271(A2) |
申请公布日期 |
2004.09.30 |
申请号 |
WO2004US07863 |
申请日期 |
2004.03.16 |
申请人 |
TOKYO ELECTRON LIMITED;WALLACE, JAY;HAMELIN, THOMAS |
发明人 |
WALLACE, JAY;HAMELIN, THOMAS |
分类号 |
C23C16/44;C25D11/02;H01L21/00;H01L21/677 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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