METHODS FOR PRODUCING A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT

摘要

Production of a semiconductor component (1) comprises; (a) forming electrical contact surfaces together within a smaller contacting region (31) as the whole surface of the front side (33) of the semiconductor chip (3); (b) applying a buffer layer (7) on a rear plate (83) forming the rear side surface (81); (c) applying and fixing the chip on the buffer layer to the rear side; (d) applying a buffer layer on and around the chip; and (e) fixing a contact passage plate (84) with a recess (85) on the buffer layer on the front side of the chip. An Independent claim is also included for an alternative process for the production of the semiconductor component.