| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable mounting of components on a substrate under short unit process time even if the number of components is increased to which mounting with high precision is required. <P>SOLUTION: When the substrate of a first sheet is produced, component mounting data which determine component mounting positions based on measurement of each IC mark position are stored. When a substrate after a second sheet is produced in the case that positional relationship of measured IC marks is judged as matching with positional relationship in converted component mounting data within the limits (S41, S43), a corresponding IC mark position is generated from the converted component mounting data without measuring other IC mark positions of the same substrate (S48), and component mounting is performed. By the constitution, time duration required for acquisition of IC marks is shortened remarkably, and component mounting efficiency can be increased remarkably. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
