| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface mount semiconductor device which is fixed by soldering onto a land provided at a substrate, and to provide a method for manufacturing the semiconductor device. <P>SOLUTION: A surface mount semiconductor device 10 is fixed to a wiring board 11 by mounting solder junctions 21 each formed at a portion of a lead terminal 3 on a component land 12 formed on the wiring board 11, and by soldering the lands 12 to the junctions 21, respectively. Arrangement is made such that no resin burr 19 is formed in the region sandwiched between the junctions 21 formed in a part of the lead terminal 3 and, and resin burrs 19 are left in the other portions which make contact with the lands 12 of the lead terminals 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
