| 摘要 |
PROBLEM TO BE SOLVED: To provide a film having low hygroscopicity, high dielectric constant, low dielectric loss and good formability in manufacture. SOLUTION: The film is composed of a thermosetting resin composition produced by compounding a thermosetting resin consisting of a polycarbodiimide having a structure expressed by general formula (I) (R is an organic diisocyanate residue; R<SP>1</SP>is an organic monoisocyanate residue; and n is an integer of 1-100) with inorganic powder having a dielectric constant of≥10 and an average particle diameter of 0.1-5μm. The compounding amount of the inorganic powder is 3-34 vol.%. COPYRIGHT: (C)2004,JPO&NCIPI
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