发明名称 |
Device performance improvement by heavily doped pre-gate and post polysilicon gate clean |
摘要 |
The present disclosure provides a method is provided for fabricating a metal oxide semiconductor (MOS) gate stack on a semiconductor substrate. The method includes generating moisture on a surface of the semiconductor substrate to form an oxide layer less than 10 nanometers thin and performing a nitridation process on the thin oxide layer. After the nitridation process, the method includes performing a polysilicon deposition process on the surface of the semiconductor substrate, doping the polysilicon deposition to a level of 5x1015 at/cm3, and cleaning the doped polysilicon with a light ammonia solution.
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申请公布号 |
US2004192017(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030395345 |
申请日期 |
2003.03.24 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
CHEN CHIA-LIN;LEE TZE-LIANG;CHEN SHIH-CHANG |
分类号 |
H01L21/28;H01L21/306;H01L21/321;H01L29/51;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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