| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective tape attaching/detaching method which is capable of attaching a plurality of protective tapes on the surface of a semiconductor wafer in layers and detaching the protective tapes attached to the processed thin semiconductor wafer in layers accurately from the wafer without imposing loads on the wafer. SOLUTION: A protective tape T1 attached by a tape attaching mechanism to the surface of a wafer W sucked up and held by a chuck table is cut into a wafer shape by a cutter unit. Then, the protective tape T3 whose adhesive force is weaker than that of the protective tape T1 is attached on the protective tape T1. The protective tapes T1 and T3 attached to the wafer W in layers are detached by a tape detaching device 15 sheet by sheet in turn after the wafer W is subjected to a thinning process. COPYRIGHT: (C)2004,JPO&NCIPI |
