| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable Hall element having a stable electric characteristic by giving to it such an element structure as to reduce the application of the stress caused by its mounting board to the bottom surface of its resin-sealed package. SOLUTION: In the Hall element, a semiconductor chip 1 mounted on a lead frame 2 is sealed with a resin, and by bending each lead 2b along each side surface of a resin-sealed portion 4 which is derived from each side surface, there is provided each lead terminal 6 so subjected to a forming working as to adapt the height position of each end 6a to its soldering to a board 7. Further, with respect to the Hall element, a stress relaxing layer 5 made of a silicone rubber, etc. is provided in the bottom surface part of the resin-sealed portion 4 which is to be positioned on the side of the board 7. COPYRIGHT: (C)2004,JPO&NCIPI |
