| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip from an extremely thin wafer by using a cutting machine and a grinder. SOLUTION: This method comprises: coating the active side 3 of a wafer with especially a photosensitive lacquer 4, preferably a protective layer having a thickness of 3 to 50μm; coating the active side 3 with a mask having an optical transmission line along an intermediate portion with a width of preferably about 5 to 100μm between a plurality of integrated circuits; forming a groove 8 with a depth 10 of about 10 to 150μm by the optical transmission line; and grinding the rear face 12 of the wafer in such a manner that the thickness of the wafer is about 100 to 150μm, so as to take out a chip. COPYRIGHT: (C)2004,JPO&NCIPI |
