| 摘要 |
PROBLEM TO BE SOLVED: To reduce the probability of generating crack in a semiconductor chip in a post-process by reducing a probability of generating chipping in the front and rear side surface rims of a semiconductor chip. SOLUTION: Half cut system partitioning process utilizing a dicing blade is effected from both of front and rear sides of a silicon wafer 2 (Fig.(a)-(d)). The edge of the dicing blade 1 employed upon the partitioning process is provided with a configuration that the thickness thereof is gradually thickened from the tip end toward the inside of radial direction. In another method, the wafer is partitioned by applying an etching process engraving by etching a scribe line from the surface side of the wafer, and another etching process engraving the scribe line by etching from the rear side of the wafer to manufacture a plurality of semiconductor chips. COPYRIGHT: (C)2004,JPO&NCIPI |
