SUB-MOUNT FOR SEMICONDUCTOR LASER DIODE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR LASER DIODE ASSEMBLY ADOPTING THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sub-mount for semiconductor laser diode, its manufacturing method, and a semiconductor laser diode assembly adopting the method. SOLUTION: The sub-mount for semiconductor laser diode which is flip chip bonded to a semiconductor laser diode chip provided with stepped first and second electrodes contains a substrate provided with first and second stepped surfaces having a difference of elevation corresponding to the steps of the first and second electrodes, first and second metallic layers respectively formed on the first and second stepped surfaces to have the same thickness, and first and second solder layers respectively formed on the first and second metallic layers to have the same thickness and respectively joined to the first and second electrodes. COPYRIGHT: (C)2004,JPO&NCIPI