| 摘要 |
PROBLEM TO BE SOLVED: To make an optical module highly in reliable, small in size and high in integration. SOLUTION: The optical module includes a first substrate 30 on which a wiring pattern 40 is formed and while includes a light transmissive portion, an optical chip 10 which includes an electrode 24 and an optical portion 12, is electrically connected to the wiring pattern 40 via the electrode 24 and is packaged on a first side 32 of the first substrate 30 so that the optical portion 12 is turned toward the light transmissive portion 12, a case 70 which is packaged on a second side 34 opposed to the first side 32 of the first substrate 30, holds a lens 72 in a position corresponding to the optical portion 12 and is formed to surround at least the optical portion 12, and a second substrate 50 which is provided on the opposite side of the first substrate 30 in the optical chip 10 and planarly overlapped on at least a portion of the optical chip 10. COPYRIGHT: (C)2004,JPO&NCIPI
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