METHOD OF REMOVING PROCESS LIQUID ADHERED TO PRINTED CIRCUIT BOARD AND AIR NOZZLE FOR REMOVING ADHERED PROCESS LIQUID

摘要

PROBLEM TO BE SOLVED: To make removable a process liquid adhered inside a small hole of a printed circuit board not only by direct jetting of air but in such a position where no direct jetting of air is performed. SOLUTION: The air jetted from an air nozzle 1 provided on one surface side of a printed circuit board 4 is led into a clearance between the printed circuit board 4 and the flat face 2 of a tip end of the air nozzle, and a pressure on one surface side of the printed circuit board 4 is made lower than that on the other surface side thereof to make a difference in pressure on the front and rear sides of the printed circuit board 4, thereby sucking and removing a process liquid adhered inside small holes 5a and 5c. COPYRIGHT: (C)2004,JPO&NCIPI