Packaged microelectronic devices and methods for assembling microelectronic devices

摘要

Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an interposer substrate includes depositing a solder ball onto a ball-pad on the interposer substrate and molding a compound to form a casing around at least a portion of the die and the solder ball. The method can further include forming a first cover over a first surface of the interposer substrate with the compound and forming a second cover over a second surface opposite the first surface of the interposer substrate with the compound. The first cover can have a first volume and a first surface area and the second cover can have a second volume and a second surface area. The first and second volumes and the first and second surface areas can be at least approximately equal.