发明名称 |
Micro-channel heat exchangers and spreaders |
摘要 |
Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass having a plurality of open microchannels such that a hermetic seal is formed between the die and the bases of the microchannel walls, thus forming a plurality of closed microchannels. In another set of configurations, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. The microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The microchannels are configured to support two-phase heat transfer using a working fluid such as water. |
申请公布号 |
US2004190252(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030404215 |
申请日期 |
2003.03.31 |
申请人 |
PRASHER RAVI;MAHAJAN RAVI |
发明人 |
PRASHER RAVI;MAHAJAN RAVI |
分类号 |
F28D15/02;F28F7/02;H01L21/56;H01L23/427;(IPC1-7):H05K7/20;F28F7/00 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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