| 摘要 |
PROBLEM TO BE SOLVED: To prevent cutting scraps from easily adhering onto the surface of an IC wafer, and to reduce damage caused by the cutting scraps . SOLUTION: An apparatus for cutting the IC wafer comprises an IC wafer supporting apparatus for fixing the IC wafer, a dicing apparatus for cutting the IC wafer by using rotary blades, and a storage tank for storing a cooling cleaning liquid for cooling and cleaning the rotary knife and the IC wafer. The IC wafer is dipped into the cooling cleaning liquid, is erected for installation, and is cut. COPYRIGHT: (C)2004,JPO&NCIPI |
