| 摘要 |
PROBLEM TO BE SOLVED: To provide a load lock chamber capable of securing specific throughput and performing quality processing by reducing a decrease in temperature in a wafer caused by adiabatic expansion when substituting atmosphere and the adhesion of particles to the wafer, and to provide a processing system and a treating method. SOLUTION: The load lock chamber is provided between a port that accommodates a body to be processed and is maintained at an atmospheric pressure and a processing chamber that is maintained at a reduced pressure or a vacuum environment and performs specific processing to the body to be processed, can substitute the atmosphere, and delivers the body to be processed between the port and the processing chamber. The load lock chamber comprises a first load lock chamber having a first retention section for retaining the body to be processed delivered from the port, and a second load lock chamber having a second retention for retaining the body to be processed delivered from the processing chamber. COPYRIGHT: (C)2004,JPO&NCIPI
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