THERMOPLASTIC RESIN MATERIAL AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin material permitting the formation of a high density circuit and having excellent adhesiveness, further, capable of maintaining a bonding strength even in the atmosphere of high-temperature and high-humidity, while capable of enduring the manufacturing process of a wiring board; and to provide a printed circuit board employing the material. SOLUTION: Recesses and projections are formed on a surface by removing a metallic foil after laminating a thermoplastic resin and the metallic foil having a roughened surface. In another way, a treatment wherein such a surface treatment is combined with the other surface treatment of removing one part of a surface layer of the plastic resin is applied to manufacture the printed circuit board employing the thermoplastic resin material (film) obtained by the treatment. COPYRIGHT: (C)2004,JPO&NCIPI