发明名称 PARTIAL PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a partial plating method for a bulk polymer which is obtained by bulk-polymerization for one or more alicyclic olefins in the presence of one or more metathesis catalysts. SOLUTION: The partial plating method comprises the steps of: bonding a compound capable of coordinating metal to the surface of the molded article from a bulk polymer which has been obtained by bulk polymerization for one or more alicyclic olefins in the presence of one or more metathesis catalysts, to form a pattern; and then electroless plating the pattern.The bulk polymer particularly containing few polar groups is preferably used as a material having a low dielectric dissipation factor. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004269917(A) 申请公布日期 2004.09.30
申请号 JP20030059054 申请日期 2003.03.05
申请人 NIPPON ZEON CO LTD 发明人 ODEMURA JUNJI;KATO YUTAKA;WAKIZAKA YASUHIRO
分类号 C23C18/20;C23C18/16;H05K3/18;H05K3/38;(IPC1-7):C23C18/20 主分类号 C23C18/20
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