发明名称 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
摘要 |
A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of forming the doped tin-indium solder is also disclosed. A microelectronic package is also disclosed that uses the doped tin-indium solder composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the doped tin-indium solder.
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申请公布号 |
US2004188503(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030405056 |
申请日期 |
2003.03.31 |
申请人 |
HUA FAY |
发明人 |
HUA FAY |
分类号 |
B23K35/02;B23K35/14;B23K35/26;H01L21/60;H01L23/485;H05K3/34;(IPC1-7):B23K35/12 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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