| 摘要 |
A light-emitting device (10) using an LED is proposed. This light-emitting device (10) is provided with a packaging substrate (1), a light-emitting element (2) which is mounted on this packaging substrate (1) with its face down, a fluorescent member (3) that is arranged face to face with a light-extracting surface (S) of the light-emitting element (2) without contacting the light-emitting element (2) and an optical member (4) which receives light that has been emitted from the light-emitting element (2) and made incident thereon through the fluorescent member (3), and aligns the incident light toward the outside of the device. Light, emitted from the light-emitting element (2), is made incident on the fluorescent member (3) to excite the fluorescent material so that the fluorescent material re-emits light having a wavelength different from that of the incident light. Those light rays, emitted from the light-emitting element (2), which have not been absorbed by the fluorescent member (3) and have passed through the fluorescent member (3) and those light rays that have been emitted from the fluorescent material are made incident on the optical member (4) and are aligned. Because the fluorescent member (3) is not made in contact with the light-emitting element (2), it does not receive the heat from the light-emitting element (2) through heat conduction, and consequently becomes less susceptible to degradation due to heat. Moreover, with the face-down mounting structure, the fluorescent member (3) and the optical member (4) can be placed closer to the light-emitting element (2) as long as they dose not contact the light-emitting element (2). Consequently, the service life of the fluorescent material or the fluorescent-material-mixed resin that tends to deteriorate can be lengthened, lights can be extracted more efficiently, and light rays can be properly aligned in a predetermined direction.
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