Method of integrating a porous dielectric in an integrated circuit device

摘要

The present invention is a method which provides flexibility and convenience in integration of porous dielectric materials without any substantial sacrifice in quality of the porous dielectric material formed during the process. This method enables one to create multilayer stacks that include embedded porous layers without having to remove the substrate being coated from the spin track between applications of the various layers and without deterioration in pore morphology in the porous layers.