发明名称 COOLING UNIT FOR COOLING HEAT GENERATING COMPONENT
摘要 An electronic apparatus has a housing (4), a heat generating component (13) arranged in the housing (4), a heat pipe (21) including a flat heat receiving surface (28) integrally formed at one end (24a), a deformable thermal conductive material (34), and a heat radiation member (22). The deformable thermal conductive material (34) is arranged between the flat heat receiving surface (28) and athe heat generating component (13), and thermally connects to the flat heat receiving surface (28) and the heat generating component (13). The heat radiation member (22) is thermally connectsed to the other end (24b) of the heat pipe (21).
申请公布号 WO2004003713(A3) 申请公布日期 2004.09.30
申请号 WO2003JP00537 申请日期 2003.01.22
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KAMIKAWA, YOSHINORI;OOKA, SATOSHI
分类号 F28D15/02;G06F1/20;H01L23/427;H05K7/20 主分类号 F28D15/02
代理机构 代理人
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