发明名称 |
Low stress flip-chip package for low-K silicon technology |
摘要 |
An underfill includes a base material and a filler material added to the base material wherein the filler material constitutes a selected percentage by weight of the underfill to provide an optimum balance between interfacial die stress and solder bump strain for next generation, Cu, low-K silicon technology. |
申请公布号 |
US2004188862(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030396955 |
申请日期 |
2003.03.24 |
申请人 |
NAGARAJAN KUMAR;KUTLU ZAFER |
发明人 |
NAGARAJAN KUMAR;KUTLU ZAFER |
分类号 |
H01L21/56;H01L23/29;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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