发明名称 EQUIPMENT FOR FILLING UNDERFILLER, SEMICONDUCTOR MOUNTING BOARD, AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide equipment for filling underfiller capable of feeding a small quantity of underfiller stably, a semiconductor mounting board filled with underfiller using the filling equipment and an electronic apparatus comprising the semiconductor mounting board. <P>SOLUTION: The equipment 10 for filling underfiller comprises a pot 19 for storing underfiller 6, a laser displacement gage 20 for measuring the liquid level of the underfiller 6 in the pot 19, and a head section 18 having a pin 181 movable relatively to the pot 19. Movement of the head section 18 in the direction perpendicular to the pot 19 is controlled such that the pin 181 is immersed substantially constantly into the underfiller 6 based on the measurements of liquid level of the underfiller 6 taken by means of the laser displacement gage 20. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273539(A) 申请公布日期 2004.09.30
申请号 JP20030058669 申请日期 2003.03.05
申请人 SEIKO EPSON CORP 发明人 TAMURA SHUICHI;SEKI SHIGEAKI
分类号 H01L21/56 主分类号 H01L21/56
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