| 摘要 |
PROBLEM TO BE SOLVED: To realize an electronic apparatus having excellent heat sink properties by applying a thermomodule to an object to be cooled and movable to relatively change the positions of an object to be heat dissipated and the object to be cooled in the electronic apparatus having the thermomodule using a Peltier effect. SOLUTION: The object 12 to be cooled is installed on a cooling side substrate becoming the cooling surface of the thermomodule 11 using the Peltier effect, and is heat dissipated to the object 16 to be heat dissipated via a heat transfer member 14 having a movable means or a deforming means on the heat dissipating side substrate. Then, a following means for realizing the relative positional change to the object 12 to be cooled is provided so that, even if one of the thermomodule 11 and the object 16 to be heat dissipated is moved, the other can follow the motion. The object 16 to be heat dissipated is independently moved so as to improve the heat dissipating properties. COPYRIGHT: (C)2004,JPO&NCIPI |
