ELECTRONIC PACKAGE WITH COMPRESSIBLE HEATSINK STRUCTURE

摘要

AN ELECTRONIC PACKAGE (10,10'',10")WHEREIN AN ELECTRONIC DEVICE (18)(E.G., CHIP) ON A CIRCUITIZED SUBSTRATE (12) OF THE PACKAGE IS THERMALLY COUPLED TO A HEATSINK (22) IN A SEPARABLE MANNER USING A PLURALITY OF COMPRESSIBLE, THERMALLY CONDUCTIVE MEMBERS (26,26'',26")(E.G., SOLDER BALLS). THESE MEMBERS ARE COMPRESSED AND PERMANENTLY DEFORMED AS PART OF THE THERMAL COUPLING.