发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC IMAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which radiates heat well and controls direction of light properly, and provide its manufacturing method and an electronic imaging apparatus. <P>SOLUTION: The semiconductor light emitting device comprises a lead frame 1 with a main face 1a, a LED chip 4, epoxy resin 6 completely covering the LED chip 4, and a resin part 3 enclosing the LED chip 4. The epoxy resin 6 has a top face 6a. The resin part 3 has a top face 3a of which distance from the main face 1a is larger than that between the top face 6 and the main face 1a, and an inner wall 3b which in the side of the LED chip 4 and extends in the direction apart from the main face 1a to join to the top face 3a. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004274027(A) 申请公布日期 2004.09.30
申请号 JP20030419433 申请日期 2003.12.17
申请人 SHARP CORP 发明人 TAKENAKA YASUJI
分类号 H01L33/54;H01L25/075;H01L33/56;H01L33/62 主分类号 H01L33/54
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