| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for heating elements which can improve cooling performance by reducing heat resistance between the heating element and a refrigerant, and to provide a power electronic device having the same. SOLUTION: The cooling device for the heating elements comprises a heat sink 1 which is composed of a first platy member 1a mounting heating elements 2a-2d thereon, a second platy member opposed to the member 1a, and a pair of side walls and a wall 1d integrally formed with these members, and connected to a first refrigerant pipe 3 for sending out the refrigerant in a cavity at the end 1e of the opposite side of the wall 1d; a header 4 which is integrally formed with the heat sink on the second platy member 1b side and connected to a second refrigerant pipe 6 for sending in the refrigerant, having opening parts 5a-5d for sending out the refrigerant on the positions corresponding to the backsides of the heating elements 2a-2d; and a plurality of guide plates 7a which are arranged on the peripheral edges of the opening parts 5a-5d so as to form a prescribed angle of more than 0°to the direction directed from a point on each central axis of the opening parts 5a-5d toward the outside. COPYRIGHT: (C)2004,JPO&NCIPI |
