| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can supply treatment liquid in a good condition to a substrate without a contamination problem associated with predispensing, and to provide a substrate treatment method. SOLUTION: A chemical pumped up from a chemical tank 5 is circulated to the chemical tank 5 via a temperature control device 52, a branch BC11 and a chemical circulation path 54. The chemical is supplied via a treatment liquid supply valve VC 11, a treatment liquid distribution path 21, a treatment liquid supply valve VT, a treatment liquid supply pipe 2, and a rear surface nozzle 3 to the center of the rear surface of a wafer W which is supported by a spin chuck 1. When the chemical is predispensed, the treatment liquid supply valve VT is closed and a chemical exhaust valve VC21 is opened. The chemical predispensed is returned to the chemical tank 5 via a first chemical returning path 57. The treatment liquid staying in the liquid supply pipe 2 and the treatment liquid distribution path 21 can be exhausted to a suction/exhaust path 41 by opening the treatment liquid supply valve VT and a treatment liquid suction valve VV. COPYRIGHT: (C)2004,JPO&NCIPI
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